Produced with high degree of diamond power and tungsten-carbide substrate with US-developed technology American
Microstructure with complete C-C bond combination is characterized between the grains of the diamond in polycrystalline diamond layer, which allows for high strength, hardness and durability of diamond layer
We adopt many types of claw structure for the interface between the diamond layer and tungsten carbide substrate. We use special technological late conditions in order to effectively reduce residual stress of PDC while making the interface combination firmer and more symmetrical.
